Whatever the specific features of your application, we are able to integrate and bring together all the necessary technologies in the same electronic design (electronics, digital, analogue and power):
- high-density multi-layer high-speed routing (controlled impedance and crosstalk)
- 3D viewing of electronic sub-assemblies and integration in their mechanical environment
- consideration of EMC and thermal constraints right from the design phase
- consideration of in-situ Jtag testability right from the design phase
The variety of our technological know-how enables us to propose the following solutions:
- Scalable architecture on fieldbus (CAN, Ethercat, Profinet, etc.)
- Multi-core A9 cortex high-performance hybrid architecture, DSP, graphics controller
- Gigabit communication controller
- Analogue acquisition and high-performance digitisation
- Switching converter (Flyback, Buck, Sepic, Forward, PFC, H bridge and three-phase, etc.)
We offer bespoke multi-technology “All-in-One” solutions.
